WELLMID 2015,bonding and repair adhesive,Repair SMC,Repair GRP,Repair,FRP
Detailed introduction:
WELLMID 2015 is two component,room temperature curing epoxy paste adhesive;it is particularly recommended as bonding agent and repair adhesive for Metal and FRP,GRP,SMC industry. • Room temperature curing thixotropic epoxy adhesive • Good mechanical strength • Strong bond with a wide variety of materials • Water proofing and good chemical resistance • Good gap filling properties
